This book constitutes the thoroughly refereed post-proceedings of the Second International Workshop on Radical Agent Concepts, WRAC 2005, held in Greenbelt, MD, USA in September 2005. The 27 full papers presented are fully revised to incorporate reviewers' comments and discussions at the workshop. Topics addressed are social aspects of agents, agent architectures, autonomic systems, agent communities, and agent intelligence.
Success in automatic assembly design and operation comes from an awareness and sensitivity to a multitude of small design details, and only Frank Riley could pack so much knowledge and experience into a practical and authoritative guide to the selection and application of automatic assembly machinery. A vast amount of practical information about all aspects of automated assembly can be found in this important revised edition.
This book covers the entire spectrum of assembly, packaging and testing of MEMs (microelectro-mechanical systems) and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering.
Present Your Research to the World! The World Congress 2009 on Medical Physics and Biomedical Engineering – the triennial scientific meeting of the IUPESM - is the world’s leading forum for presenting the results of current scientific work in health-related physics and technologies to an international audience. With more than 2,800 presentations it will be the biggest conference in the fields of Medical Physics and Biomedical Engineering in 2009! Medical physics, biomedical engineering and bioengineering have been driving forces of innovation and progress in medicine and healthcare over the past two decades. As new key technologies arise with significant potential to open new options in diagnostics and therapeutics, it is a multidisciplinary task to evaluate their benefit for medicine and healthcare with respect to the quality of performance and therapeutic output. Covering key aspects such as information and communication technologies, micro- and nanosystems, optics and biotechnology, the congress will serve as an inter- and multidisciplinary platform that brings together people from basic research, R&D, industry and medical application to discuss these issues. As a major event for science, medicine and technology the congress provides a comprehensive overview and in–depth, first-hand information on new developments, advanced technologies and current and future applications. With this Final Program we would like to give you an overview of the dimension of the congress and invite you to join us in Munich! Olaf Dössel Congress President Wolfgang C.
The Hybrid Deliberative Layer (HDL) solves the problem that an intelligent agent faces in dealing with a large amount of information which may or may not be useful in generating a plan to achieve a goal. The information, that an agent may need, is acquired and stored in the DL model. Thus, the HDL is used as the main knowledge base system for the agent. In this work, a novel approach which amalgamates Description Logic (DL) reasoning with Hierarchical Task Network (HTN) planning is introduced. An analysis of the performance of the approach has been conducted and the results show that this approach yields significantly smaller planning problem descriptions than those generated by current representations in HTN planning.
This book features papers focusing on the implementation of new and future technologies, which were presented at the International Conference on New Technologies, Development and Application, held at the Academy of Science and Arts of Bosnia and Herzegovina in Sarajevo on 27th–29th June 2019. It covers a wide range of future technologies and technical disciplines, including complex systems such as Industry 4.0; robotics; mechatronics systems; automation; manufacturing; cyber-physical and autonomous systems; sensors; networks; control, energy, automotive and biological systems; vehicular networking and connected vehicles; effectiveness and logistics systems, smart grids, as well as nonlinear, power, social and economic systems. We are currently experiencing the Fourth Industrial Revolution “Industry 4.0”, and its implementation will improve many aspects of human life in all segments, and lead to changes in business paradigms and production models. Further, new business methods are emerging, transforming production systems, transport, delivery, and consumption, which need to be monitored and implemented by every company involved in the global market.
Hyper Bio Assembler for Cellular Systems is the first book to present a new methodology for measuring and separating target cells at high speed and constructing 3D cellular systems in vitro. This book represents a valuable resource for biologists, biophysicists and robotic engineers, as well as researchers interested in this new frontier area, offering a better understanding of the measurement, separation, assembly, analysis and synthesis of complex biological tissue, and of the medical applications of these technologies. This book is the outcome of the new academic fields of the Ministry of Education, Culture, Sports, Science and Technology’s Grant-in-Aid for Scientific Research in Japan.
This book discusses the new generation of integrated microfabricated devices, including DNA chips, Lab-on-a-Chip, microcapillary electrophoresis systems, biosensors, and microanalytical systems. It traces their development with the established and evolving technologies such as microlithography, micromachining, microelectromechanical systems, microfluids, and nanotechnology.
This book presents 53 independently reviewed papers which embody the latest advances in the theory, design, control and application of robotic systems, which are intended for a variety of purposes such as manipulation, manufacturing, automation, surgery, locomotion and biomechanics. Methods used include line geometry, quaternion algebra, screw algebra, and linear algebra. These methods are applied to both parallel and serial multi-degree-of-freedom systems. The contributors are recognised authorities in robot kinematics.
The 33rd Annual German Conference on Arti?cial Intelligence (KI 2010) took place at the Karlsruhe Institute of Technology KIT, September 21–24, 2010, under the motto “Anthropomatic Systems.” In this volume you will ?nd the keynote paper and 49 papers of oral and poster presentations. The papers were selected from 73 submissions, resulting in an acceptance rate of 67%. As usual at the KI conferences, two entire days were allocated for targeted workshops—seventhis year—andone tutorial. The workshopand tutorialma- rials are not contained in this volume, but the conference website, www.ki2010.kit.edu,will provide information and references to their contents. Recent trends in AI research have been focusing on anthropomatic systems, which address synergies between humans and intelligent machines. This trend is emphasized through the topics of the overall conference program. They include learning systems, cognition, robotics, perception and action, knowledge rep- sentation and reasoning, and planning and decision making. Many topics deal with uncertainty in various scenarios and incompleteness of knowledge. Summarizing, KI 2010 provides a cross section of recent research in modern AI methods and anthropomatic system applications. We are very grateful that Jos ́ edel Mill ́ an, Hans-Hellmut Nagel, Carl Edward Rasmussen, and David Vernon accepted our invitation to give a talk.
This volume gathers the latest advances, innovations and applications in the field of condition monitoring, plant maintenance and reliability, as presented by leading international researchers and engineers at the 5th International Conference on Maintenance Engineering and the 2020 Annual Conference of the Centre for Efficiency and Performance Engineering Network (IncoME-V & CEPE Net-2020), held in Zhuhai, China on October 23-25, 2020. Topics include vibro-acoustics monitoring, condition-based maintenance, sensing and instrumentation, machine health monitoring, maintenance auditing and organization, non-destructive testing, reliability, asset management, condition monitoring, life-cycle cost optimisation, prognostics and health management, maintenance performance measurement, manufacturing process monitoring, and robot-based monitoring and diagnostics. The contributions, which were selected through a rigorous international peer-review process, share exciting ideas that will spur novel research directions and foster new multidisciplinary collaborations.
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.
