Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Author: E-H Wong

Publisher: Woodhead Publishing

ISBN: 9780857099112

Category: Technology & Engineering

Page: 482

View: 425

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study
Cyber-Physical Systems: Design and Application for Industry 4.0

Author: Alla G. Kravets

Publisher: Springer Nature

ISBN: 9783030660819

Category: Technology & Engineering

Page: 452

View: 451

This book consists of chapters dedicated to the questions of cyber-physical system design and its usage for the chemical industry and new material design. Also, the contribution of the book covers scientific research and their results for cyber-physical systems design and application in the energy domain and solutions regarding engineering education for cyber-physical systems design. The book offers unique content for researchers and practitioners who are looking for new knowledge and skills in the framework of Industry 4.0 solutions. The book also benefits researchers and practitioners in chemistry and new material design and manufacturing to understand how cyber-physical systems can be applied to increase efficiency and performance. The target audience of the book are practitioners, enterprises representatives, scientists, Ph.D. and master students who perform scientific research or applications of cyber-physical systems in the concept of Industry 4.0.
Proceedings

Author:

Publisher: Society of Photo Optical

ISBN: CORNELL:31924081323697

Category: Electronic packaging

Page: 742

View: 826

Contains the proceedings of IMAPS '97 in Adobe portable document format (PDF).